Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

Nr. stoc RS: 752-4904Producator: BergquistCod de producator: HF650P-0.001-01-00-20
brand-logo
Vezi toate produsele din Placute de transfer termic

Documente tehnice

Specificatii

Marca

Bergquist

Grosime

0.001in

Diametru

12.95mm

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Frecventa minima de auto-rezonanta

-40°C

Temperatura maxima de lucru

+150°C

Material

Hi-Flow 650P

Temperatura de lucru

-40 → +150 °C

Tara de origine

United States

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

P.O.A.

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P

50

Disponibil in multiplu de 50
50P.O.A.
100P.O.A.
150P.O.A.
200P.O.A.
250P.O.A.
300P.O.A.
350P.O.A.
400P.O.A.
450P.O.A.
500P.O.A.
550P.O.A.
600P.O.A.
650P.O.A.
700P.O.A.
750P.O.A.

P.O.A.

Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Informatii indisponibile despre stoc

50

Disponibil in multiplu de 50
50P.O.A.
100P.O.A.
150P.O.A.
200P.O.A.
250P.O.A.
300P.O.A.
350P.O.A.
400P.O.A.
450P.O.A.
500P.O.A.
550P.O.A.
600P.O.A.
650P.O.A.
700P.O.A.
750P.O.A.

Documente tehnice

Specificatii

Marca

Bergquist

Grosime

0.001in

Diametru

12.95mm

Thermal Conductivity

1.5W/m·K

Material

Hi-Flow 650P

Self-Adhesive

Yes

Frecventa minima de auto-rezonanta

-40°C

Temperatura maxima de lucru

+150°C

Material

Hi-Flow 650P

Temperatura de lucru

-40 → +150 °C

Tara de origine

United States