Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Documente tehnice
Specificatii
Marca
BergquistGrosime
0.001in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
+150°C
Material
Hi-Flow 650P
Temperatura de lucru
-40 → +150 °C
Tara de origine
United States
Detalii produs
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.
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Incercati din nou mai tarziu
€ 2,94
Buc. (Intr-o punga de 50) (fara TVA)
€ 3,499
Buc. (Intr-o punga de 50) (cu TVA)
50
€ 2,94
Buc. (Intr-o punga de 50) (fara TVA)
€ 3,499
Buc. (Intr-o punga de 50) (cu TVA)
50
Cumpara in pachete mari
| Cantitate | Pret unitar | Per Punga |
|---|---|---|
| 50 - 450 | € 2,94 | € 147,00 |
| 500 - 1200 | € 2,74 | € 137,00 |
| 1250 - 2450 | € 2,62 | € 131,00 |
| 2500 - 4950 | € 2,51 | € 125,50 |
| 5000+ | € 2,41 | € 120,50 |
Documente tehnice
Specificatii
Marca
BergquistGrosime
0.001in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
+150°C
Material
Hi-Flow 650P
Temperatura de lucru
-40 → +150 °C
Tara de origine
United States
Detalii produs
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.