Bergquist Self-Adhesive Thermal Interface Pad, 0.127mm Thick, 0.5W/m·K, Hi-Flow 625, 25 x 19mm
Documente tehnice
Specificatii
Marca
BergquistDimensiuni
25 x 19mm
Grosime
0.127mm
Lungime
25mm
Latime
19mm
Thermal Conductivity
0.5W/m·K
Material
Hi-Flow 625
Self-Adhesive
Yes
Frecventa minima de auto-rezonanta
-30°C
Temperatura maxima de lucru
+150°C
Material
Hi-Flow 625
Temperatura de lucru
-30 → +150 °C
Tara de origine
United States
Detalii produs
HI-FLOW phase change product
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
€ 1,68
Buc. (Intr-un pachet de 50) (fara TVA)
€ 1,999
Buc. (Intr-un pachet de 50) (cu TVA)
50
€ 1,68
Buc. (Intr-un pachet de 50) (fara TVA)
€ 1,999
Buc. (Intr-un pachet de 50) (cu TVA)
50
Cumpara in pachete mari
| Cantitate | Pret unitar | Per Pachet |
|---|---|---|
| 50 - 450 | € 1,68 | € 84,00 |
| 500 - 2450 | € 1,47 | € 73,50 |
| 2500+ | € 1,30 | € 65,00 |
Documente tehnice
Specificatii
Marca
BergquistDimensiuni
25 x 19mm
Grosime
0.127mm
Lungime
25mm
Latime
19mm
Thermal Conductivity
0.5W/m·K
Material
Hi-Flow 625
Self-Adhesive
Yes
Frecventa minima de auto-rezonanta
-30°C
Temperatura maxima de lucru
+150°C
Material
Hi-Flow 625
Temperatura de lucru
-30 → +150 °C
Tara de origine
United States
Detalii produs