Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
Documente tehnice
Specificatii
Marca
BergquistDimensiuni
11 x 12in
Grosime
0.102mm
Lungime
11in
Latime
12in
Thermal Conductivity
1W/m·K
Material
Hi-Flow 225F-AC
Self-Adhesive
Yes
Temperatura maxima de lucru
+120°C
Material
Hi-Flow 225F-AC
Temperatura de lucru
Maximum of +120 °C
Tara de origine
United States
Detalii produs
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules
P.O.A.
1
P.O.A.
1
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
Documente tehnice
Specificatii
Marca
BergquistDimensiuni
11 x 12in
Grosime
0.102mm
Lungime
11in
Latime
12in
Thermal Conductivity
1W/m·K
Material
Hi-Flow 225F-AC
Self-Adhesive
Yes
Temperatura maxima de lucru
+120°C
Material
Hi-Flow 225F-AC
Temperatura de lucru
Maximum of +120 °C
Tara de origine
United States
Detalii produs
Hi-Flow® 225 FAC
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules