Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

Nr. stoc RS: 127-041Producator: BergquistCod de producator: HF225FAC-0.004-AC-1112
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Specificatii

Marca

Bergquist

Dimensiuni

11 x 12in

Grosime

0.102mm

Lungime

11in

Latime

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Temperatura maxima de lucru

+120°C

Material

Hi-Flow 225F-AC

Temperatura de lucru

Maximum of +120 °C

Tara de origine

United States

Detalii produs

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

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Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

1

Disponibil in multiplu de 1
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P.O.A.

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
Informatii indisponibile despre stoc

1

Disponibil in multiplu de 1
1P.O.A.
2P.O.A.
3P.O.A.
4P.O.A.
5P.O.A.
6P.O.A.
7P.O.A.
8P.O.A.
9P.O.A.
10P.O.A.
11P.O.A.
12P.O.A.
13P.O.A.
14P.O.A.
15P.O.A.

Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

11 x 12in

Grosime

0.102mm

Lungime

11in

Latime

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Temperatura maxima de lucru

+120°C

Material

Hi-Flow 225F-AC

Temperatura de lucru

Maximum of +120 °C

Tara de origine

United States

Detalii produs

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules