Documente tehnice
Specificatii
Marca
Amphenol ICCDimensiune celula
BergStak
Pitch
0.8mm
Numar contacte
80
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Montare
Surface Mount
Connector System
Board to Board
Terminal
Solder
Material de contact
Brass
Placa contact
Gold
Curent nominal
800.0mA
Tensiune
100.0 V
Detalii produs
0.8mm Bergstak® Series
These FCI Bergstk® high density 0.8mm pitch SMT connectors provide space saving in board to board stacking applications.
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Documente tehnice
Specificatii
Marca
Amphenol ICCDimensiune celula
BergStak
Pitch
0.8mm
Numar contacte
80
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Montare
Surface Mount
Connector System
Board to Board
Terminal
Solder
Material de contact
Brass
Placa contact
Gold
Curent nominal
800.0mA
Tensiune
100.0 V
Detalii produs
0.8mm Bergstak® Series
These FCI Bergstk® high density 0.8mm pitch SMT connectors provide space saving in board to board stacking applications.