Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
Amphenol ICCNumar contacte
80
Number Of Rows
2
Pitch
0.8mm
Tip produs
Board to Board
Montare
Surface Mount
Body Orientation
Straight
Terminal
Solder
Curent nominal
800mA
Tensiune nominala
100 V
Serie
BergStak
Material de contact
Copper
Detalii produs
0.8mm Bergstak® Series
These FCI Bergstk® high density 0.8mm pitch SMT connectors provide space saving in board to board stacking applications.
P.O.A.
1
P.O.A.
Informatii despre stoc temporar indisponibile
1
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
Amphenol ICCNumar contacte
80
Number Of Rows
2
Pitch
0.8mm
Tip produs
Board to Board
Montare
Surface Mount
Body Orientation
Straight
Terminal
Solder
Curent nominal
800mA
Tensiune nominala
100 V
Serie
BergStak
Material de contact
Copper
Detalii produs
0.8mm Bergstak® Series
These FCI Bergstk® high density 0.8mm pitch SMT connectors provide space saving in board to board stacking applications.


