Documente tehnice
Specificatii
Marca
Amphenol ICCNumar contacte
26
Subtip
Male
Body Orientation
Right Angle
Montare
Through Hole
Pitch
2.29mm
D Connector Type
High Density D-Sub
Terminal
Solder
Curent nominal
2.5A
Housing Material
Thermoplastic
Tensiune
250.0 V
Lungime
39.24mm
Latime
16.2mm
Adancime
12.55mm
Material de contact
Copper Alloy
Placa contact
Gold over Nickel
Dimensiune celula
10090926
Dimensiuni
39.24 x 16.2 x 12.55mm
Frecventa minima de auto-rezonanta
-55.0°C
Temperatura maxima de lucru
+105°C
Tara de origine
China
Detalii produs
D-Sub Compact HD with Clinch Nuts
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.
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Documente tehnice
Specificatii
Marca
Amphenol ICCNumar contacte
26
Subtip
Male
Body Orientation
Right Angle
Montare
Through Hole
Pitch
2.29mm
D Connector Type
High Density D-Sub
Terminal
Solder
Curent nominal
2.5A
Housing Material
Thermoplastic
Tensiune
250.0 V
Lungime
39.24mm
Latime
16.2mm
Adancime
12.55mm
Material de contact
Copper Alloy
Placa contact
Gold over Nickel
Dimensiune celula
10090926
Dimensiuni
39.24 x 16.2 x 12.55mm
Frecventa minima de auto-rezonanta
-55.0°C
Temperatura maxima de lucru
+105°C
Tara de origine
China
Detalii produs
D-Sub Compact HD with Clinch Nuts
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.