Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount

Nr. stoc RS: 903-3144Producator: ABL ComponentsCod de producator: 180AB1000B
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Specificatii

Marca

ABL Components

Utilizare cu

Universal Rectangular Alu

Lungime

100mm

Latime

215mm

Inaltime

77mm

Dimensiuni

100 x 215 x 77mm

Thermal Resistance

0.14°C/W

Montare

PCB Mount

Serie

100

Material

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finisare

Anodized

Tara de origine

United Kingdom

Detalii produs

Heat Sink 180AB Series, 215mm Wide x 77mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

Informatii indisponibile despre stoc

P.O.A.

Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount

1

Disponibil in multiplu de 1
1P.O.A.
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11P.O.A.
12P.O.A.
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14P.O.A.
15P.O.A.

P.O.A.

Heatsink, Universal Rectangular Alu, 0.14°C/W, 100 x 215 x 77mm, PCB Mount
Informatii indisponibile despre stoc

1

Disponibil in multiplu de 1
1P.O.A.
2P.O.A.
3P.O.A.
4P.O.A.
5P.O.A.
6P.O.A.
7P.O.A.
8P.O.A.
9P.O.A.
10P.O.A.
11P.O.A.
12P.O.A.
13P.O.A.
14P.O.A.
15P.O.A.

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Documente tehnice

Specificatii

Marca

ABL Components

Utilizare cu

Universal Rectangular Alu

Lungime

100mm

Latime

215mm

Inaltime

77mm

Dimensiuni

100 x 215 x 77mm

Thermal Resistance

0.14°C/W

Montare

PCB Mount

Serie

100

Material

Aluminium

Application

High Power Semiconductor Device, Optoelectronic Device

Finisare

Anodized

Tara de origine

United Kingdom

Detalii produs

Heat Sink 180AB Series, 215mm Wide x 77mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.