Documente tehnice
Specificatii
Marca
AAVID THERMALLOYUtilizare cu
Universal Round Alu
Inaltime
9.14mm
Dimensiuni
28.58 (Dia.) x 9.14mm
Thermal Resistance
23.4°C/W
Diametru
28.58mm
Culoare
Black
Tip pachet
BGA
Detalii produs
BGA Heatsink, Radial Fin
Bond-on heatsinks for leadless chip carriers and flat-packs.
BGA Heatsinks
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
Informatii indisponibile despre stoc
€ 11,26
Buc. (fara TVA)
€ 13,40
Buc. (cu TVA)
AAVID THERMALLOY Heatsink, Universal Round Alu, 23.4°C/W, 28.58 (Dia.) x 9.14mm
1
€ 11,26
Buc. (fara TVA)
€ 13,40
Buc. (cu TVA)
AAVID THERMALLOY Heatsink, Universal Round Alu, 23.4°C/W, 28.58 (Dia.) x 9.14mm
Informatii indisponibile despre stoc
1
Documente tehnice
Specificatii
Marca
AAVID THERMALLOYUtilizare cu
Universal Round Alu
Inaltime
9.14mm
Dimensiuni
28.58 (Dia.) x 9.14mm
Thermal Resistance
23.4°C/W
Diametru
28.58mm
Culoare
Black
Tip pachet
BGA
Detalii produs
BGA Heatsink, Radial Fin
Bond-on heatsinks for leadless chip carriers and flat-packs.