Documente tehnice
Specificatii
Marca
WinbondMemory Size
1Gbit
Interfata
Quad-SPI
Tip pachet
TFBGA
Numar pini
24
Organisation
128M x 8 bit
Montare
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
1.7 V
Maximum Operating Supply Voltage
1.95 V
Dimensiuni
8.05 x 6.05 x 0.85mm
Number of Words
128M
Temperatura minima de lucru
-40 °C
Number of Bits per Word
8bit
Temperatura maxima de lucru
+85 °C
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P.O.A.
480
P.O.A.
480
Documente tehnice
Specificatii
Marca
WinbondMemory Size
1Gbit
Interfata
Quad-SPI
Tip pachet
TFBGA
Numar pini
24
Organisation
128M x 8 bit
Montare
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
1.7 V
Maximum Operating Supply Voltage
1.95 V
Dimensiuni
8.05 x 6.05 x 0.85mm
Number of Words
128M
Temperatura minima de lucru
-40 °C
Number of Bits per Word
8bit
Temperatura maxima de lucru
+85 °C