Documente tehnice
Specificatii
Marca
TE ConnectivityCard Type
MicroSD, SIM
Subtip
Male
Numar contacte
20
Number Of Rows
1
Body Orientation
Straight
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Gold
Terminal
Solder
Housing Material
Stainless Steel
Lungime
18.3mm
Latime
27.95mm
Adancime
1.52mm
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
+85°C
Dimensiuni
18.3 x 27.95 x 1.52mm
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P.O.A.
Standard
1
P.O.A.
Standard
1
Documente tehnice
Specificatii
Marca
TE ConnectivityCard Type
MicroSD, SIM
Subtip
Male
Numar contacte
20
Number Of Rows
1
Body Orientation
Straight
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Gold
Terminal
Solder
Housing Material
Stainless Steel
Lungime
18.3mm
Latime
27.95mm
Adancime
1.52mm
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
+85°C
Dimensiuni
18.3 x 27.95 x 1.52mm