Documente tehnice
Specificatii
Marca
MolexCard Type
SIM
Subtip
Female
Numar contacte
6
Pitch
2.54mm
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Tin
Terminal
Solder
Housing Material
Thermoplastic
Lungime
25.52mm
Latime
17.7mm
Adancime
1.9mm
Dimensiuni
25.52 x 17.7 x 1.9mm
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
+85°C
Dimensiune celula
47388
Tara de origine
China
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€ 1,77
Buc. (Pe o rola de 200) (fara TVA)
€ 2,106
Buc. (Pe o rola de 200) (cu TVA)
200
Documente tehnice
Specificatii
Marca
MolexCard Type
SIM
Subtip
Female
Numar contacte
6
Pitch
2.54mm
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Tin
Terminal
Solder
Housing Material
Thermoplastic
Lungime
25.52mm
Latime
17.7mm
Adancime
1.9mm
Dimensiuni
25.52 x 17.7 x 1.9mm
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
+85°C
Dimensiune celula
47388
Tara de origine
China