Documente tehnice
Specificatii
Marca
MolexSubtip
Male
Insertion/Removal Method
Push/Push
Numar contacte
8
Pitch
1.1mm
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Gold over Nickel, Tin
Terminal
Solder
Housing Material
Thermoplastic
Lungime
14.0mm
Latime
15.2mm
Adancime
1.88mm
Temperatura maxima de lucru
+85°C
Dimensiuni
14 x 15.2 x 1.88mm
Dimensiune celula
47352
Frecventa minima de auto-rezonanta
-20°C
Tara de origine
China
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
€ 3,31
Buc. (Pe o rola de 200) (fara TVA)
€ 3,939
Buc. (Pe o rola de 200) (cu TVA)
200
€ 3,31
Buc. (Pe o rola de 200) (fara TVA)
€ 3,939
Buc. (Pe o rola de 200) (cu TVA)
200
Cumpara in pachete mari
Cantitate | Pret unitar | Per Rola |
---|---|---|
200 - 200 | € 3,31 | € 662,00 |
400 - 800 | € 3,04 | € 608,00 |
1000 - 1800 | € 2,86 | € 572,00 |
2000+ | € 2,69 | € 538,00 |
Documente tehnice
Specificatii
Marca
MolexSubtip
Male
Insertion/Removal Method
Push/Push
Numar contacte
8
Pitch
1.1mm
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Gold over Nickel, Tin
Terminal
Solder
Housing Material
Thermoplastic
Lungime
14.0mm
Latime
15.2mm
Adancime
1.88mm
Temperatura maxima de lucru
+85°C
Dimensiuni
14 x 15.2 x 1.88mm
Dimensiune celula
47352
Frecventa minima de auto-rezonanta
-20°C
Tara de origine
China