Documente tehnice
Specificatii
Marca
MolexSerie
KK 396
Pitch
3.96mm
Numar contacte
3
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Unshrouded
Connector System
Board to Board, Wire to Board
Montare
Through Hole
Terminal
Solder
Placa contact
Tin
Material de contact
Brass
Dimensiune celula
171813
Curent nominal
7.0A
Tensiune nominala
250.0 V
Detalii produs
KK 396 Reflow Process Compatible (RCP) Friction Lock Headers
The KK 396 Reflow Process Compatible (RCP) Friction Lock Headers are designed to with stand +260° C temperatures and does not need the drying requirements of normal nylon. This range of KK 396 Reflow Process Compatible (RCP) Friction Lock Headers are Matte-tin over nickel plated which inhibits tin whiskering. A PCB thickness of 1.60 mm is recommended for these KK 396 Reflow Process Compatible (RCP) Friction Lock Headers.
3.96mm Molex KK Range
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Documente tehnice
Specificatii
Marca
MolexSerie
KK 396
Pitch
3.96mm
Numar contacte
3
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Unshrouded
Connector System
Board to Board, Wire to Board
Montare
Through Hole
Terminal
Solder
Placa contact
Tin
Material de contact
Brass
Dimensiune celula
171813
Curent nominal
7.0A
Tensiune nominala
250.0 V
Detalii produs
KK 396 Reflow Process Compatible (RCP) Friction Lock Headers
The KK 396 Reflow Process Compatible (RCP) Friction Lock Headers are designed to with stand +260° C temperatures and does not need the drying requirements of normal nylon. This range of KK 396 Reflow Process Compatible (RCP) Friction Lock Headers are Matte-tin over nickel plated which inhibits tin whiskering. A PCB thickness of 1.60 mm is recommended for these KK 396 Reflow Process Compatible (RCP) Friction Lock Headers.