Documente tehnice
Specificatii
Marca
MolexSerie
KK 396
Pitch
3.96mm
Numar contacte
2
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Unshrouded
Connector System
Wire to Board
Montare
Through Hole
Terminal
Solder
Placa contact
Tin
Material de contact
Brass
Curent nominal
7.0A
Dimensiune celula
5273
Tail Pin Length
3.6mm
Tensiune nominala
250.0 V
Tara de origine
China
Detalii produs
Molex KK 396 3.96 mm PCB Pin Headers - 5273 Series
KK 396 3.96 mm pitch pin headers for use in KK 396 series number 5239 and SPOX 5195 series crimp housings. These PCB pin headers feature a friction locking mechanism for a secure mating connection and are suitable for use in a wide range of applications in the automotive, industrial, consumer, datacommunication and telecommunications industries.
3.96mm Molex KK Range
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
€ 14,00
€ 0,14 Each (Supplied in a Bag) (fara TVA)
€ 16,66
€ 0,167 Each (Supplied in a Bag) (cu TVA)
Impachetare pentru productie (Punga)
100
€ 14,00
€ 0,14 Each (Supplied in a Bag) (fara TVA)
€ 16,66
€ 0,167 Each (Supplied in a Bag) (cu TVA)
Impachetare pentru productie (Punga)
100
Cumpara in pachete mari
Cantitate | Pret unitar | Per Punga |
---|---|---|
100 - 240 | € 0,14 | € 1,40 |
250 - 490 | € 0,13 | € 1,30 |
500 - 990 | € 0,13 | € 1,30 |
1000+ | € 0,12 | € 1,20 |
Documente tehnice
Specificatii
Marca
MolexSerie
KK 396
Pitch
3.96mm
Numar contacte
2
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Unshrouded
Connector System
Wire to Board
Montare
Through Hole
Terminal
Solder
Placa contact
Tin
Material de contact
Brass
Curent nominal
7.0A
Dimensiune celula
5273
Tail Pin Length
3.6mm
Tensiune nominala
250.0 V
Tara de origine
China
Detalii produs
Molex KK 396 3.96 mm PCB Pin Headers - 5273 Series
KK 396 3.96 mm pitch pin headers for use in KK 396 series number 5239 and SPOX 5195 series crimp housings. These PCB pin headers feature a friction locking mechanism for a secure mating connection and are suitable for use in a wide range of applications in the automotive, industrial, consumer, datacommunication and telecommunications industries.