Documente tehnice
Specificatii
Marca
BergquistThermal Conductivity
1.5W/m·K
Material
Non-Silicone
Temperatura maxima de lucru
+150°C
Pack Size
0.5 ml
Temperatura de lucru
Maximum of +150 °C
Tara de origine
United States
Detalii produs
TIC™ 1000A Compound
Thermally compound intended for use as thermal interface between processors and heatsink.
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Documente tehnice
Specificatii
Marca
BergquistThermal Conductivity
1.5W/m·K
Material
Non-Silicone
Temperatura maxima de lucru
+150°C
Pack Size
0.5 ml
Temperatura de lucru
Maximum of +150 °C
Tara de origine
United States
Detalii produs
TIC™ 1000A Compound
Thermally compound intended for use as thermal interface between processors and heatsink.