Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 25.4 x 19.05mm

Nr. stoc RS: 468-2735Producator: BergquistCod de producator: SPK10-0.006-00104
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Specificatii

Marca

Bergquist

Dimensiuni

25.4 x 19.05mm

Grosime

0.152mm

Lungime

25.4mm

Latime

19.05mm

Thermal Conductivity

1.3W/m·K

Material

Thin Film Polyimide

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K10

Temperatura de lucru

-60 → +180 °C

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P.O.A.

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 25.4 x 19.05mm

1

Disponibil in multiplu de 1
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P.O.A.

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 25.4 x 19.05mm
Informatii indisponibile despre stoc

1

Disponibil in multiplu de 1
1P.O.A.
2P.O.A.
3P.O.A.
4P.O.A.
5P.O.A.
6P.O.A.
7P.O.A.
8P.O.A.
9P.O.A.
10P.O.A.
11P.O.A.
12P.O.A.
13P.O.A.
14P.O.A.
15P.O.A.
S-ar putea să te intereseze

Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

25.4 x 19.05mm

Grosime

0.152mm

Lungime

25.4mm

Latime

19.05mm

Thermal Conductivity

1.3W/m·K

Material

Thin Film Polyimide

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K10

Temperatura de lucru

-60 → +180 °C

S-ar putea să te intereseze