Documente tehnice
Specificatii
Marca
SemtechDirection Type
Bi-Directional
Diode Configuration
Single
Maximum Clamping Voltage
28.5V
Minimum Breakdown Voltage
13.3V
Timp montare
Surface Mount
Tip pachet
SLP EP
Maximum Reverse Stand-off Voltage
12V
Numar pini
2
Peak Pulse Power Dissipation
200W
Maximum Peak Pulse Current
7A
ESD protection
Yes
Number of Elements per Chip
1
Temperatura minima de lucru
-55 °C
Temperatura maxima de lucru
+125 °C
Dimensiuni
1 x 0.6 x 0.47mm
Maximum Reverse Leakage Current
1µA
Inaltime
0.47mm
Latime
0.6mm
Test Current
1mA
Lungime
1mm
P.O.A.
Buc. (Intr-un pachet de 10) (fara TVA)
10
P.O.A.
Buc. (Intr-un pachet de 10) (fara TVA)
10
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Documente tehnice
Specificatii
Marca
SemtechDirection Type
Bi-Directional
Diode Configuration
Single
Maximum Clamping Voltage
28.5V
Minimum Breakdown Voltage
13.3V
Timp montare
Surface Mount
Tip pachet
SLP EP
Maximum Reverse Stand-off Voltage
12V
Numar pini
2
Peak Pulse Power Dissipation
200W
Maximum Peak Pulse Current
7A
ESD protection
Yes
Number of Elements per Chip
1
Temperatura minima de lucru
-55 °C
Temperatura maxima de lucru
+125 °C
Dimensiuni
1 x 0.6 x 0.47mm
Maximum Reverse Leakage Current
1µA
Inaltime
0.47mm
Latime
0.6mm
Test Current
1mA
Lungime
1mm