Documente tehnice
Specificatii
Marca
WinbondMemory Size
8Mbit
Interfata
Quad-SPI
Tip pachet
SOIC
Numar pini
8
Organisation
1M x 8 bit
Timp montare
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Lungime
5.38mm
Inaltime
1.91mm
Latime
5.38mm
Dimensiuni
5.38 x 5.38 x 1.91mm
Number of Bits per Word
8bit
Temperatura maxima de lucru
+85 °C
Maximum Random Access Time
6ns
Serie
W25Q
Number of Words
1M
Frecventa minima de auto-rezonanta
-40 °C
P.O.A.
Each (In a Tube of 90) (fara TVA)
90
P.O.A.
Each (In a Tube of 90) (fara TVA)
90
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Documente tehnice
Specificatii
Marca
WinbondMemory Size
8Mbit
Interfata
Quad-SPI
Tip pachet
SOIC
Numar pini
8
Organisation
1M x 8 bit
Timp montare
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Lungime
5.38mm
Inaltime
1.91mm
Latime
5.38mm
Dimensiuni
5.38 x 5.38 x 1.91mm
Number of Bits per Word
8bit
Temperatura maxima de lucru
+85 °C
Maximum Random Access Time
6ns
Serie
W25Q
Number of Words
1M
Frecventa minima de auto-rezonanta
-40 °C