TDK 33μF Multilayer Ceramic Capacitor MLCC, 10V dc V, ±20% , SMD

Nr. stoc RS: 916-2996Producator: TDKCod de producator: C3225X5R1A336M200AC
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Documente tehnice

Specificatii

Marca

TDK

Capacitate

33µF

Tensiune

10V dc

Package/Case

1210 (3225M)

Timp montare

Surface Mount

Dielectric

X5R

Toleranta

±20%

Dimensiuni

3.2 x 2.5 x 2mm

Lungime

3.2mm

Adancime

2.5mm

Inaltime

2mm

Serie

C

Temperatura maxima de lucru

+85°C

Temperatura minima de lucru

-55°C

Tip terminal

Surface Mount

Detalii produs

TDK Type 1210 Series C3225

MLCC C Series is a monolithic structure that ensures superior mechanical strength and reliability.
High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.

Informatii despre stoc temporar indisponibile

€ 6,30

€ 0,63 Buc. (Intr-un pachet de 10) (fara TVA)

€ 7,50

€ 0,75 Buc. (Intr-un pachet de 10) (cu TVA)

TDK 33μF Multilayer Ceramic Capacitor MLCC, 10V dc V, ±20% , SMD
Selectati tipul de ambalaj

€ 6,30

€ 0,63 Buc. (Intr-un pachet de 10) (fara TVA)

€ 7,50

€ 0,75 Buc. (Intr-un pachet de 10) (cu TVA)

TDK 33μF Multilayer Ceramic Capacitor MLCC, 10V dc V, ±20% , SMD
Informatii despre stoc temporar indisponibile
Selectati tipul de ambalaj

Informatii despre stoc temporar indisponibile

Incercati din nou mai tarziu

CantitatePret unitarPer Pachet
10 - 90€ 0,63€ 6,30
100 - 240€ 0,55€ 5,50
250 - 490€ 0,47€ 4,70
500 - 990€ 0,38€ 3,80
1000+€ 0,31€ 3,10

Documente tehnice

Specificatii

Marca

TDK

Capacitate

33µF

Tensiune

10V dc

Package/Case

1210 (3225M)

Timp montare

Surface Mount

Dielectric

X5R

Toleranta

±20%

Dimensiuni

3.2 x 2.5 x 2mm

Lungime

3.2mm

Adancime

2.5mm

Inaltime

2mm

Serie

C

Temperatura maxima de lucru

+85°C

Temperatura minima de lucru

-55°C

Tip terminal

Surface Mount

Detalii produs

TDK Type 1210 Series C3225

MLCC C Series is a monolithic structure that ensures superior mechanical strength and reliability.
High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.