Bergquist Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 41.91 x 28.96mm
Documente tehnice
Specificatii
Marca
BergquistDimensiuni
41.91 x 28.96mm
Grosime
0.152mm
Lungime
41.91mm
Latime
28.96mm
Thermal Conductivity
1.3W/m·K
Material
Thin Film Polyimide
Temperatura minima de lucru
-60°C
Temperatura maxima de lucru
+180°C
Hardness
Shore A 90
Material
Sil-Pad K10
Temperatura de lucru
-60 → +180 °C
Tara de origine
United States
Detalii produs
Sil-Pad K10 insulators
P.O.A.
Buc. (Intr-un pachet de 10) (fara TVA)
10
P.O.A.
Buc. (Intr-un pachet de 10) (fara TVA)
10
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Documente tehnice
Specificatii
Marca
BergquistDimensiuni
41.91 x 28.96mm
Grosime
0.152mm
Lungime
41.91mm
Latime
28.96mm
Thermal Conductivity
1.3W/m·K
Material
Thin Film Polyimide
Temperatura minima de lucru
-60°C
Temperatura maxima de lucru
+180°C
Hardness
Shore A 90
Material
Sil-Pad K10
Temperatura de lucru
-60 → +180 °C
Tara de origine
United States
Detalii produs
Sil-Pad K10 insulators