Documente tehnice
Specificatii
Marca
WinslowPitch
1.27 mm, 7.62 mm
End 1
14 Pin Female DIP
End 2
14 Pin Male SOJ/SOP
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
DIP
End 2 Type
SOJ/SOP
End 1 Gender
Female
End 2 Gender
Male
Montare
Surface Mount
Body Orientation
Straight
Material de contact
Beryllium Copper
Placa contact
Tin over Nickel
Housing Material
FR4
Tara de origine
United Kingdom
Detalii produs
DIP to SOIC Sockets
Two piece Adaptics that convert dual in line packages to small outline ICs format. The top is detachable from the base by way of socket contacts, allowing the two parts to be plugged and unplugged and making the surface mounting of the base much easier.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
€ 34,85
€ 34,85 Buc. (fara TVA)
€ 41,47
€ 41,47 Buc. (cu TVA)
1
€ 34,85
€ 34,85 Buc. (fara TVA)
€ 41,47
€ 41,47 Buc. (cu TVA)
1
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Cantitate | Pret unitar |
---|---|
1 - 24 | € 34,85 |
25 - 74 | € 31,08 |
75 - 199 | € 27,37 |
200 - 399 | € 23,71 |
400+ | € 21,80 |
Documente tehnice
Specificatii
Marca
WinslowPitch
1.27 mm, 7.62 mm
End 1
14 Pin Female DIP
End 2
14 Pin Male SOJ/SOP
End 1 Number of Contacts
14
End 2 Number of Contacts
14
End 1 Type
DIP
End 2 Type
SOJ/SOP
End 1 Gender
Female
End 2 Gender
Male
Montare
Surface Mount
Body Orientation
Straight
Material de contact
Beryllium Copper
Placa contact
Tin over Nickel
Housing Material
FR4
Tara de origine
United Kingdom
Detalii produs
DIP to SOIC Sockets
Two piece Adaptics that convert dual in line packages to small outline ICs format. The top is detachable from the base by way of socket contacts, allowing the two parts to be plugged and unplugged and making the surface mounting of the base much easier.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.