Documente tehnice
Specificatii
Marca
WinbondMemory Size
4Mbit
Interfata
Quad-SPI
Tip pachet
SOIC
Numar pini
8
Organisation
512K x 8 bit
Timp montare
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
1.65 V
Maximum Operating Supply Voltage
1.95 V
Block Organisation
Symmetrical
Lungime
5mm
Inaltime
1.5mm
Latime
4mm
Dimensiuni
5 x 4 x 1.5mm
Serie
W25Q
Number of Words
512K
Temperatura minima de lucru
-40 °C
Temperatura maxima de lucru
+85 °C
Maximum Random Access Time
6ns
Number of Bits per Word
8bit
P.O.A.
Buc. (Intr-un pachet de 25) (fara TVA)
Standard
25
P.O.A.
Buc. (Intr-un pachet de 25) (fara TVA)
Standard
25
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Documente tehnice
Specificatii
Marca
WinbondMemory Size
4Mbit
Interfata
Quad-SPI
Tip pachet
SOIC
Numar pini
8
Organisation
512K x 8 bit
Timp montare
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
1.65 V
Maximum Operating Supply Voltage
1.95 V
Block Organisation
Symmetrical
Lungime
5mm
Inaltime
1.5mm
Latime
4mm
Dimensiuni
5 x 4 x 1.5mm
Serie
W25Q
Number of Words
512K
Temperatura minima de lucru
-40 °C
Temperatura maxima de lucru
+85 °C
Maximum Random Access Time
6ns
Number of Bits per Word
8bit