Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 19.05 x 12.7mm

Nr. stoc RS: 707-3355Producator: BergquistCod de producator: SPK6-0.006-00-54
brand-logo

Documente tehnice

Specificatii

Dimensiuni

19.05 x 12.7mm

Grosime

0.152mm

Lungime

19.05mm

Latime

12.7mm

Thermal Conductivity

1.1W/m·K

Material

Thin Film Polyimide

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K6

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil Pad® K6

Informatii indisponibile despre stoc

€ 5,00

€ 0,50 Buc. (Intr-un pachet de 10) (fara TVA)

€ 5,95

€ 0,595 Buc. (Intr-un pachet de 10) (cu TVA)

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 19.05 x 12.7mm

€ 5,00

€ 0,50 Buc. (Intr-un pachet de 10) (fara TVA)

€ 5,95

€ 0,595 Buc. (Intr-un pachet de 10) (cu TVA)

Bergquist Thermal Interface Pad, 0.152mm Thick, 1.1W/m·K, Thin Film Polyimide, 19.05 x 12.7mm
Informatii indisponibile despre stoc

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

CantitatePret unitarPer Pachet
10 - 40€ 0,50€ 5,00
50 - 240€ 0,45€ 4,50
250 - 490€ 0,40€ 4,00
500 - 990€ 0,37€ 3,70
1000+€ 0,35€ 3,50

Documente tehnice

Specificatii

Dimensiuni

19.05 x 12.7mm

Grosime

0.152mm

Lungime

19.05mm

Latime

12.7mm

Thermal Conductivity

1.1W/m·K

Material

Thin Film Polyimide

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K6

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil Pad® K6