Documente tehnice
Specificatii
Marca
WinbondMemory Size
1Gbit
Interfata
Quad-SPI
Tip pachet
SOIC
Numar pini
16
Organisation
128M x 8 bit
Timp montare
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensiuni
10.49 x 7.59 x 2.34mm
Number of Bits per Word
8bit
Temperatura maxima de lucru
+85 °C
Number of Words
128M
Frecventa minima de auto-rezonanta
-40 °C
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P.O.A.
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P.O.A.
5
Documente tehnice
Specificatii
Marca
WinbondMemory Size
1Gbit
Interfata
Quad-SPI
Tip pachet
SOIC
Numar pini
16
Organisation
128M x 8 bit
Timp montare
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensiuni
10.49 x 7.59 x 2.34mm
Number of Bits per Word
8bit
Temperatura maxima de lucru
+85 °C
Number of Words
128M
Frecventa minima de auto-rezonanta
-40 °C