TDK 330nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD

Nr. stoc RS: 916-3059Producator: TDKCod de producator: C3225X7T2E334K200AA
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Documente tehnice

Specificatii

Marca

TDK

Capacitate

330nF

Tensiune

250V dc

Package/Case

1210 (3225M)

Timp montare

Surface Mount

Dielectric

X7T

Toleranta

±10%

Dimensiuni

3.2 x 2.5 x 2mm

Lungime

3.2mm

Adancime

2.5mm

Inaltime

2mm

Serie

C

Temperatura minima de lucru

-55°C

Tip terminal

Surface Mount

Temperatura maxima de lucru

+125°C

Detalii produs

TDK Type 1210 Series C3225

MLCC C Series is a monolithic structure that ensures superior mechanical strength and reliability.
High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.

Informatii despre stoc temporar indisponibile

€ 9,00

€ 0,45 Buc. (Intr-un pachet de 20) (fara TVA)

€ 10,71

€ 0,536 Buc. (Intr-un pachet de 20) (cu TVA)

TDK 330nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD
Selectati tipul de ambalaj

€ 9,00

€ 0,45 Buc. (Intr-un pachet de 20) (fara TVA)

€ 10,71

€ 0,536 Buc. (Intr-un pachet de 20) (cu TVA)

TDK 330nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD
Informatii despre stoc temporar indisponibile
Selectati tipul de ambalaj

Informatii despre stoc temporar indisponibile

Incercati din nou mai tarziu

CantitatePret unitarPer Pachet
20 - 80€ 0,45€ 9,00
100 - 180€ 0,29€ 5,80
200 - 480€ 0,26€ 5,20
500 - 980€ 0,24€ 4,80
1000+€ 0,22€ 4,40

Documente tehnice

Specificatii

Marca

TDK

Capacitate

330nF

Tensiune

250V dc

Package/Case

1210 (3225M)

Timp montare

Surface Mount

Dielectric

X7T

Toleranta

±10%

Dimensiuni

3.2 x 2.5 x 2mm

Lungime

3.2mm

Adancime

2.5mm

Inaltime

2mm

Serie

C

Temperatura minima de lucru

-55°C

Tip terminal

Surface Mount

Temperatura maxima de lucru

+125°C

Detalii produs

TDK Type 1210 Series C3225

MLCC C Series is a monolithic structure that ensures superior mechanical strength and reliability.
High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.