Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecNumar contacte
100
Number Of Rows
2
Pitch
0.8mm
Tip produs
Board to Board
Montare
Surface Mount
Body Orientation
Straight
Terminal
Solder
Curent nominal
1.4A
Tensiune nominala
200 V
Serie
ERF8
Material de contact
Beryllium Copper
Detalii produs
ERF8 Series Rugged High Speed Sockets
These Board to Board ERF8 Series, SMT, 0.8 mm pitch high speed Sockets from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERF8 Series, SMT, 0.8 mm pitch high speed Sockets have an above board height of 5.1 mm.
0.8mm Board to Board - Samtec
P.O.A.
Standard
1
P.O.A.
Informatii despre stoc temporar indisponibile
Standard
1
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecNumar contacte
100
Number Of Rows
2
Pitch
0.8mm
Tip produs
Board to Board
Montare
Surface Mount
Body Orientation
Straight
Terminal
Solder
Curent nominal
1.4A
Tensiune nominala
200 V
Serie
ERF8
Material de contact
Beryllium Copper
Detalii produs
ERF8 Series Rugged High Speed Sockets
These Board to Board ERF8 Series, SMT, 0.8 mm pitch high speed Sockets from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERF8 Series, SMT, 0.8 mm pitch high speed Sockets have an above board height of 5.1 mm.