Documente tehnice
Specificatii
Marca
MolexCard Type
Chip SIM
Subtip
Female
Insertion/Removal Method
Push/Push
Numar contacte
6
Pitch
2.54mm
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Gold over Nickel, Tin
Terminal
Solder
Housing Material
Thermoplastic
Lungime
26.0mm
Latime
22.8mm
Adancime
3.0mm
Dimensiune celula
91228
Dimensiuni
26 x 22.8 x 3mm
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
+85°C
Tara de origine
Ireland
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Buc. (cu TVA)
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Cantitate | Pret unitar |
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200+ | € 10,33 |
Documente tehnice
Specificatii
Marca
MolexCard Type
Chip SIM
Subtip
Female
Insertion/Removal Method
Push/Push
Numar contacte
6
Pitch
2.54mm
Montare
Surface Mount
Material de contact
Copper Alloy
Placa contact
Gold over Nickel, Tin
Terminal
Solder
Housing Material
Thermoplastic
Lungime
26.0mm
Latime
22.8mm
Adancime
3.0mm
Dimensiune celula
91228
Dimensiuni
26 x 22.8 x 3mm
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
+85°C
Tara de origine
Ireland