Documente tehnice
Specificatii
Marca
InfineonNume familie
XC166
Tip pachet
MQFP
Timp montare
Surface Mount
Numar pini
80
Device Core
C166
Data Bus Width
16bit
Frecventa maxima
20MHz
Capacitate RAM
2 (IRAM) kB, 2 (XRAM) kB
USB Channels
0
Number of PWM Units
0
Typical Operating Supply Voltage
2.5 → 5.5 V
Maximum Number of Ethernet Channels
0
Data Rate
1Mbps
Temperatura minima de lucru
-40 °C
Dimensiuni
14 x 14 x 2mm
Inaltime
2mm
Latime
14mm
Instruction Set Architecture
CISC, RISC
Number of ADC Units
1
Program Memory Type
ROMLess
Temperatura maxima de lucru
+85 °C
Lungime
14mm
ADCs
1 (8 x 10 bit)
Tara de origine
Malaysia
Detalii produs
C166 Family Microcontrollers, Infineon
The Infineon C166 microcontroller family are ideally suited to automotive, industrial, mass storage and wired or wireless communications applications. These microcontrollers offer better real time control performance than even 32bit, RISC processors. As a 16bit device it also offers a smaller and therefore more cost-effective footprint.
C166 Microcontrollers, Infineon
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P.O.A.
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P.O.A.
850
Documente tehnice
Specificatii
Marca
InfineonNume familie
XC166
Tip pachet
MQFP
Timp montare
Surface Mount
Numar pini
80
Device Core
C166
Data Bus Width
16bit
Frecventa maxima
20MHz
Capacitate RAM
2 (IRAM) kB, 2 (XRAM) kB
USB Channels
0
Number of PWM Units
0
Typical Operating Supply Voltage
2.5 → 5.5 V
Maximum Number of Ethernet Channels
0
Data Rate
1Mbps
Temperatura minima de lucru
-40 °C
Dimensiuni
14 x 14 x 2mm
Inaltime
2mm
Latime
14mm
Instruction Set Architecture
CISC, RISC
Number of ADC Units
1
Program Memory Type
ROMLess
Temperatura maxima de lucru
+85 °C
Lungime
14mm
ADCs
1 (8 x 10 bit)
Tara de origine
Malaysia
Detalii produs
C166 Family Microcontrollers, Infineon
The Infineon C166 microcontroller family are ideally suited to automotive, industrial, mass storage and wired or wireless communications applications. These microcontrollers offer better real time control performance than even 32bit, RISC processors. As a 16bit device it also offers a smaller and therefore more cost-effective footprint.