Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 19.05 x 12.7mm
Documente tehnice
Specificatii
Marca
BergquistDimensiuni
19.05 x 12.7mm
Grosime
0.152mm
Lungime
19.05mm
Latime
12.7mm
Thermal Conductivity
0.9W/m·K
Material
Thin Film Polyimide
Self-Adhesive
Yes
Frecventa minima de auto-rezonanta
-60°C
Temperatura maxima de lucru
+180°C
Hardness
Shore A 90
Material
Sil-Pad K4
Temperatura de lucru
-60 → +180 °C
Tara de origine
United States
Detalii produs
Sil-Pad K4 insulators
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
€ 1,03
Buc. (Intr-un pachet de 50) (fara TVA)
€ 1,226
Buc. (Intr-un pachet de 50) (cu TVA)
50
€ 1,03
Buc. (Intr-un pachet de 50) (fara TVA)
€ 1,226
Buc. (Intr-un pachet de 50) (cu TVA)
50
Cumpara in pachete mari
| Cantitate | Pret unitar | Per Pachet |
|---|---|---|
| 50 - 450 | € 1,03 | € 51,50 |
| 500 - 2450 | € 0,90 | € 45,00 |
| 2500+ | € 0,79 | € 39,50 |
Documente tehnice
Specificatii
Marca
BergquistDimensiuni
19.05 x 12.7mm
Grosime
0.152mm
Lungime
19.05mm
Latime
12.7mm
Thermal Conductivity
0.9W/m·K
Material
Thin Film Polyimide
Self-Adhesive
Yes
Frecventa minima de auto-rezonanta
-60°C
Temperatura maxima de lucru
+180°C
Hardness
Shore A 90
Material
Sil-Pad K4
Temperatura de lucru
-60 → +180 °C
Tara de origine
United States
Detalii produs
Sil-Pad K4 insulators