Documente tehnice
Specificatii
Marca
BergquistGrosime
0.001in
Diametru
12.95mm
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
+150°C
Material
Hi-Flow 650P
Temperatura de lucru
-40 → +150 °C
Tara de origine
United States
Informatii indisponibile despre stoc
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Informatii indisponibile despre stoc
P.O.A.
Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
50
P.O.A.
Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P
Informatii indisponibile despre stoc
50
Documente tehnice
Specificatii
Marca
BergquistGrosime
0.001in
Diametru
12.95mm
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
+150°C
Material
Hi-Flow 650P
Temperatura de lucru
-40 → +150 °C
Tara de origine
United States