Bergquist Self-Adhesive Thermal Interface Pad, 0.139mm Thick, 0.9W/m·K, Hi-Flow 105, 25.4 x 19mm

Nr. stoc RS: 362-9610Producator: BergquistCod de producator: HF105-0.005-AC-104
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Specificatii

Marca

Bergquist

Dimensiuni

25.4 x 19mm

Grosime

0.139mm

Lungime

25.4mm

Latime

19mm

Thermal Conductivity

0.9W/m·K

Material

Hi-Flow 105

Self-Adhesive

Yes

Temperatura minima de lucru

-30°C

Temperatura maxima de lucru

+130°C

Material

Hi-Flow 105

Temperatura de lucru

-30 → +130 °C

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Informatii indisponibile despre stoc

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Informatii indisponibile despre stoc

P.O.A.

Bergquist Self-Adhesive Thermal Interface Pad, 0.139mm Thick, 0.9W/m·K, Hi-Flow 105, 25.4 x 19mm

50

Disponibil in multiplu de 50
50P.O.A.
100P.O.A.
150P.O.A.
200P.O.A.
250P.O.A.
300P.O.A.
350P.O.A.
400P.O.A.
450P.O.A.
500P.O.A.
550P.O.A.
600P.O.A.
650P.O.A.
700P.O.A.
750P.O.A.

P.O.A.

Bergquist Self-Adhesive Thermal Interface Pad, 0.139mm Thick, 0.9W/m·K, Hi-Flow 105, 25.4 x 19mm
Informatii indisponibile despre stoc

50

Disponibil in multiplu de 50
50P.O.A.
100P.O.A.
150P.O.A.
200P.O.A.
250P.O.A.
300P.O.A.
350P.O.A.
400P.O.A.
450P.O.A.
500P.O.A.
550P.O.A.
600P.O.A.
650P.O.A.
700P.O.A.
750P.O.A.
S-ar putea să te intereseze

Documente tehnice

Specificatii

Marca

Bergquist

Dimensiuni

25.4 x 19mm

Grosime

0.139mm

Lungime

25.4mm

Latime

19mm

Thermal Conductivity

0.9W/m·K

Material

Hi-Flow 105

Self-Adhesive

Yes

Temperatura minima de lucru

-30°C

Temperatura maxima de lucru

+130°C

Material

Hi-Flow 105

Temperatura de lucru

-30 → +130 °C

S-ar putea să te intereseze