Documente tehnice
Specificatii
Marca
Amphenol ICCNumar contacte
15
Subtip
Male
Body Orientation
Straight
Montare
Panel Mount
Pitch
2.29mm
D Connector Type
High Density D-Sub
Terminal
Solder
D-Sub Shell Size
E
Curent nominal
2.5A
Housing Material
Steel
Tensiune nominala
250.0 V
Lungime
30.81mm
Latime
4.8mm
Adancime
12.55mm
Dimensiuni
30.81 x 4.8 x 12.55mm
Placa contact
Gold over Nickel
Material de contact
Copper Alloy
Frecventa minima de auto-rezonanta
-55.0°C
Temperatura maxima de lucru
+105°C
Tara de origine
China
Detalii produs
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
€ 0,96
Each (In a Tray of 90) (fara TVA)
€ 1,142
Each (In a Tray of 90) (cu TVA)
90
€ 0,96
Each (In a Tray of 90) (fara TVA)
€ 1,142
Each (In a Tray of 90) (cu TVA)
90
Documente tehnice
Specificatii
Marca
Amphenol ICCNumar contacte
15
Subtip
Male
Body Orientation
Straight
Montare
Panel Mount
Pitch
2.29mm
D Connector Type
High Density D-Sub
Terminal
Solder
D-Sub Shell Size
E
Curent nominal
2.5A
Housing Material
Steel
Tensiune nominala
250.0 V
Lungime
30.81mm
Latime
4.8mm
Adancime
12.55mm
Dimensiuni
30.81 x 4.8 x 12.55mm
Placa contact
Gold over Nickel
Material de contact
Copper Alloy
Frecventa minima de auto-rezonanta
-55.0°C
Temperatura maxima de lucru
+105°C
Tara de origine
China
Detalii produs
D-Sub Compact HD Solder Bucket with Standard Hole
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.