Documente tehnice
Specificatii
Marca
STMicroelectronicsDirection Type
Bi-Directional
Maximum Clamping Voltage
69.7V
Minimum Breakdown Voltage
36.7V
Timp montare
Surface Mount
Tip pachet
SMB
Maximum Reverse Stand-off Voltage
33V
Numar pini
2
Peak Pulse Power Dissipation
600W
Maximum Peak Pulse Current
57A
Number of Elements per Chip
1
Frecventa minima de auto-rezonanta
-55 °C
Temperatura maxima de lucru
+150 °C
Dimensiuni
4.6 x 3.95 x 2.45mm
Maximum Reverse Leakage Current
200nA
Lungime
4.6mm
Latime
3.95mm
Inaltime
2.45mm
Test Current
1mA
P.O.A.
Buc. (Intr-un pachet de 10) (fara TVA)
10
P.O.A.
Buc. (Intr-un pachet de 10) (fara TVA)
10
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Documente tehnice
Specificatii
Marca
STMicroelectronicsDirection Type
Bi-Directional
Maximum Clamping Voltage
69.7V
Minimum Breakdown Voltage
36.7V
Timp montare
Surface Mount
Tip pachet
SMB
Maximum Reverse Stand-off Voltage
33V
Numar pini
2
Peak Pulse Power Dissipation
600W
Maximum Peak Pulse Current
57A
Number of Elements per Chip
1
Frecventa minima de auto-rezonanta
-55 °C
Temperatura maxima de lucru
+150 °C
Dimensiuni
4.6 x 3.95 x 2.45mm
Maximum Reverse Leakage Current
200nA
Lungime
4.6mm
Latime
3.95mm
Inaltime
2.45mm
Test Current
1mA