Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SemtechDirection Type
Bi-Directional
Diode Configuration
Single
Maximum Clamping Voltage
28.5V
Minimum Breakdown Voltage
13.3V
Montare
Surface Mount
Tip pachet
SLP EP
Maximum Reverse Stand-off Voltage
12V
Numar pini
2
Peak Pulse Power Dissipation
200W
Maximum Peak Pulse Current
7A
ESD protection
Yes
Number of Elements per Chip
1
Temperatura minima de lucru
-55 °C
Temperatura maxima de lucru
+125 °C
Dimensiuni
1 x 0.6 x 0.47mm
Maximum Reverse Leakage Current
1µA
Inaltime
0.47mm
Latime
0.6mm
Test Current
1mA
Lungime
1mm
P.O.A.
Buc. (Intr-un pachet de 10) (fara TVA)
10
P.O.A.
Buc. (Intr-un pachet de 10) (fara TVA)
Informatii despre stoc temporar indisponibile
10
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SemtechDirection Type
Bi-Directional
Diode Configuration
Single
Maximum Clamping Voltage
28.5V
Minimum Breakdown Voltage
13.3V
Montare
Surface Mount
Tip pachet
SLP EP
Maximum Reverse Stand-off Voltage
12V
Numar pini
2
Peak Pulse Power Dissipation
200W
Maximum Peak Pulse Current
7A
ESD protection
Yes
Number of Elements per Chip
1
Temperatura minima de lucru
-55 °C
Temperatura maxima de lucru
+125 °C
Dimensiuni
1 x 0.6 x 0.47mm
Maximum Reverse Leakage Current
1µA
Inaltime
0.47mm
Latime
0.6mm
Test Current
1mA
Lungime
1mm