KEMET 33nF Multilayer Ceramic Capacitor MLCC, 100V dc V, ±10% , SMD
Documente tehnice
Specificatii
Marca
KEMETCapacitate
33nF
Tensiune
100V dc
Package/Case
0805 (2012M)
Timp montare
Surface Mount
Dielectric
X7R
Toleranta
±10%
Dimensiuni
2 x 1.25 x 0.9mm
Lungime
2mm
Adancime
1.25mm
Inaltime
0.9mm
Serie
C
Temperatura maxima de lucru
+125°C
Temperatura minima de lucru
-55°C
Tara de origine
Mexico
Detalii produs
KEMET C0805 Series
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
€ 3,00
€ 0,12 Buc. (Intr-un pachet de 25) (fara TVA)
€ 3,57
€ 0,143 Buc. (Intr-un pachet de 25) (cu TVA)
Standard
25
€ 3,00
€ 0,12 Buc. (Intr-un pachet de 25) (fara TVA)
€ 3,57
€ 0,143 Buc. (Intr-un pachet de 25) (cu TVA)
Standard
25
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Documente tehnice
Specificatii
Marca
KEMETCapacitate
33nF
Tensiune
100V dc
Package/Case
0805 (2012M)
Timp montare
Surface Mount
Dielectric
X7R
Toleranta
±10%
Dimensiuni
2 x 1.25 x 0.9mm
Lungime
2mm
Adancime
1.25mm
Inaltime
0.9mm
Serie
C
Temperatura maxima de lucru
+125°C
Temperatura minima de lucru
-55°C
Tara de origine
Mexico
Detalii produs
KEMET C0805 Series
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.