Documente tehnice
Specificatii
Marca
TE ConnectivityBackplane Connector Type
4 Pair, High Speed Hard Metric
Subtip
Male
Numar contacte
80
Number of Columns
10
Number Of Rows
8
Body Orientation
Straight
Housing Material
PET
Pitch
2.5mm
Material de contact
Phosphor Bronze
Placa contact
Gold over Nickel
Terminal
Press-In
Dimensiune celula
Z-PACK HM-Zd
Temperatura maxima de lucru
+105°C
Frecventa minima de auto-rezonanta
-65°C
Tara de origine
United States
Detalii produs
TE Connectivity Z-PACK HM-Zd Plus 4 Pair Receptacle Connector
Z-PACK HM-Zd Plus 80 way 4 pair press-fit board to board receptacle connector for updating connection between daughter card and motherboard through the addition of added ground contacts on the outside pair of the receptacle connector system resulting in enhanced performance and lower cross talk. Integrated pre-alignment features and polarization are built into the mating interface for this Z-PACK HM-Zd Plus connector to ensure secure mating and data rates of up to 15 Gbp/s with a migration plan to 20 Gbp/s can be supported. This Z-PACK HM-Zd Plus 4 pair receptacle connector can also be plugged into existing Z-PACK HM-Zd backplane connectors enabling field speed upgrades, it is also suitable for use with Advanced TCA next-generation applications and specified for Advanced zone 2 requirements. The Z-PACK HM-Zd connector is through hole mounting has a standard module size of 25mm and a 25.40mm card pitch.
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Documente tehnice
Specificatii
Marca
TE ConnectivityBackplane Connector Type
4 Pair, High Speed Hard Metric
Subtip
Male
Numar contacte
80
Number of Columns
10
Number Of Rows
8
Body Orientation
Straight
Housing Material
PET
Pitch
2.5mm
Material de contact
Phosphor Bronze
Placa contact
Gold over Nickel
Terminal
Press-In
Dimensiune celula
Z-PACK HM-Zd
Temperatura maxima de lucru
+105°C
Frecventa minima de auto-rezonanta
-65°C
Tara de origine
United States
Detalii produs
TE Connectivity Z-PACK HM-Zd Plus 4 Pair Receptacle Connector
Z-PACK HM-Zd Plus 80 way 4 pair press-fit board to board receptacle connector for updating connection between daughter card and motherboard through the addition of added ground contacts on the outside pair of the receptacle connector system resulting in enhanced performance and lower cross talk. Integrated pre-alignment features and polarization are built into the mating interface for this Z-PACK HM-Zd Plus connector to ensure secure mating and data rates of up to 15 Gbp/s with a migration plan to 20 Gbp/s can be supported. This Z-PACK HM-Zd Plus 4 pair receptacle connector can also be plugged into existing Z-PACK HM-Zd backplane connectors enabling field speed upgrades, it is also suitable for use with Advanced TCA next-generation applications and specified for Advanced zone 2 requirements. The Z-PACK HM-Zd connector is through hole mounting has a standard module size of 25mm and a 25.40mm card pitch.