Documente tehnice
Specificatii
Marca
TE ConnectivityTip produs
Open Top
Numar contacte
2
Pitch
2.54mm
Subtip
Female
Culoare
Green
Number Of Rows
1
Lungime
5.08mm
Latime
2.54mm
Adancime
6.3mm
Serie
AMPMODU Mod IV
Material de contact
Beryllium Copper
Placa contact
Gold over Nickel
Pozitionare
Straight
Tara de origine
France
Detalii produs
Shunt Connector
Suitable for applications such as linking 2 adjacent header pins on a standard 2.54mm pitch. Will mate with 0.64mm round or square posts.Glass filled polyester insulation, with tin plated beryllium copper contacts.
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
€ 0,90
Buc. (Intr-un pachet de 10) (fara TVA)
€ 1,071
Buc. (Intr-un pachet de 10) (cu TVA)
Standard
10
€ 0,90
Buc. (Intr-un pachet de 10) (fara TVA)
€ 1,071
Buc. (Intr-un pachet de 10) (cu TVA)
Standard
10
Cumpara in pachete mari
Cantitate | Pret unitar | Per Pachet |
---|---|---|
10 - 190 | € 0,90 | € 9,00 |
200 - 740 | € 0,79 | € 7,90 |
750 - 2990 | € 0,64 | € 6,40 |
3000 - 5990 | € 0,52 | € 5,20 |
6000+ | € 0,50 | € 5,00 |
Documente tehnice
Specificatii
Marca
TE ConnectivityTip produs
Open Top
Numar contacte
2
Pitch
2.54mm
Subtip
Female
Culoare
Green
Number Of Rows
1
Lungime
5.08mm
Latime
2.54mm
Adancime
6.3mm
Serie
AMPMODU Mod IV
Material de contact
Beryllium Copper
Placa contact
Gold over Nickel
Pozitionare
Straight
Tara de origine
France
Detalii produs
Shunt Connector
Suitable for applications such as linking 2 adjacent header pins on a standard 2.54mm pitch. Will mate with 0.64mm round or square posts.Glass filled polyester insulation, with tin plated beryllium copper contacts.
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.