Documente tehnice
Specificatii
Marca
SamtecSerie
SEAM
Pitch
1.27mm
Numar contacte
400
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board to Board
Montare
Surface Mount
Terminal
Solder
Placa contact
Gold
Material de contact
Copper Alloy
Detalii produs
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
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Incercati din nou mai tarziu
€ 30,89
Each (Supplied in a Bag) (fara TVA)
€ 36,76
Each (Supplied in a Bag) (cu TVA)
Impachetare pentru productie (Punga)
20
€ 30,89
Each (Supplied in a Bag) (fara TVA)
€ 36,76
Each (Supplied in a Bag) (cu TVA)
Impachetare pentru productie (Punga)
20
Cumpara in pachete mari
Cantitate | Pret unitar |
---|---|
20 - 74 | € 30,89 |
75 - 299 | € 29,77 |
300 - 599 | € 28,72 |
600+ | € 27,71 |
Documente tehnice
Specificatii
Marca
SamtecSerie
SEAM
Pitch
1.27mm
Numar contacte
400
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board to Board
Montare
Surface Mount
Terminal
Solder
Placa contact
Gold
Material de contact
Copper Alloy
Detalii produs
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.