Documente tehnice
Specificatii
Utilizare cu
Universal Square Alu
Lungime
26mm
Latime
26mm
Inaltime
12mm
Dimensiuni
26 x 26 x 12mm
Thermal Resistance
10.8K/W
Montare
Wire Clip
Tip pachet
BGA
Material
Aluminium
Tara de origine
China
Detalii produs
CCI Chipset Heatsink
Aluminium heatsink solutions suitable for variety of BGA packages. Used to provide thermal stability of electronic components and temperature dependent processes where thermal runaway would damage the operation or reliability.
BGA Heatsinks
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Documente tehnice
Specificatii
Utilizare cu
Universal Square Alu
Lungime
26mm
Latime
26mm
Inaltime
12mm
Dimensiuni
26 x 26 x 12mm
Thermal Resistance
10.8K/W
Montare
Wire Clip
Tip pachet
BGA
Material
Aluminium
Tara de origine
China
Detalii produs
CCI Chipset Heatsink
Aluminium heatsink solutions suitable for variety of BGA packages. Used to provide thermal stability of electronic components and temperature dependent processes where thermal runaway would damage the operation or reliability.