Bergquist Self-Adhesive Thermal Interface Pad, 0.127mm Thick, 0.5W/m·K, Hi-Flow 625, 25 x 19mm

Nr. stoc RS: 362-9676Producator: BergquistCod de producator: HF625-0.005-AC-104
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Documente tehnice

Specificatii

Thermal Conductivity

0.5W/m·K

Material

Hi-Flow 625

Self-Adhesive

Yes

Material

Hi-Flow 625

Temperatura minima de lucru

-30°C

Temperatura maxima de lucru

+150°C

Grosime

0.127mm

Temperatura de lucru

-30 → +150 °C

Latime

19mm

Lungime

25mm

Dimensiuni

25 x 19mm

Tara de origine

United States

Detalii produs

IDC Cabling Gun

2.54mm Kontek Comatel HE14 IEC 603-8 Range

Tin plated board to board/board to wire interconnection system

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

€ 1,64

Buc. (Intr-un pachet de 50) (fara TVA)

€ 1,952

Buc. (Intr-un pachet de 50) (cu TVA)

Bergquist Self-Adhesive Thermal Interface Pad, 0.127mm Thick, 0.5W/m·K, Hi-Flow 625, 25 x 19mm

€ 1,64

Buc. (Intr-un pachet de 50) (fara TVA)

€ 1,952

Buc. (Intr-un pachet de 50) (cu TVA)

Bergquist Self-Adhesive Thermal Interface Pad, 0.127mm Thick, 0.5W/m·K, Hi-Flow 625, 25 x 19mm
Informatii indisponibile despre stoc

Cumpara in pachete mari

CantitatePret unitarPer Pachet
50 - 450€ 1,64€ 82,00
500 - 2450€ 1,43€ 71,50
2500+€ 1,26€ 63,00

Documente tehnice

Specificatii

Thermal Conductivity

0.5W/m·K

Material

Hi-Flow 625

Self-Adhesive

Yes

Material

Hi-Flow 625

Temperatura minima de lucru

-30°C

Temperatura maxima de lucru

+150°C

Grosime

0.127mm

Temperatura de lucru

-30 → +150 °C

Latime

19mm

Lungime

25mm

Dimensiuni

25 x 19mm

Tara de origine

United States

Detalii produs

IDC Cabling Gun

2.54mm Kontek Comatel HE14 IEC 603-8 Range

Tin plated board to board/board to wire interconnection system