Documente tehnice
Specificatii
Thermal Conductivity
0.5W/m·K
Material
Hi-Flow 625
Self-Adhesive
Yes
Material
Hi-Flow 625
Temperatura minima de lucru
-30°C
Temperatura maxima de lucru
+150°C
Grosime
0.127mm
Temperatura de lucru
-30 → +150 °C
Latime
19mm
Lungime
25mm
Marca
BergquistDimensiuni
25 x 19mm
Tara de origine
United States
Detalii produs
IDC Cabling Gun
2.54mm Kontek Comatel HE14 IEC 603-8 Range
Tin plated board to board/board to wire interconnection system
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
€ 1,64
Buc. (Intr-un pachet de 50) (fara TVA)
€ 1,952
Buc. (Intr-un pachet de 50) (cu TVA)
50
€ 1,64
Buc. (Intr-un pachet de 50) (fara TVA)
€ 1,952
Buc. (Intr-un pachet de 50) (cu TVA)
50
Cumpara in pachete mari
Cantitate | Pret unitar | Per Pachet |
---|---|---|
50 - 450 | € 1,64 | € 82,00 |
500 - 2450 | € 1,43 | € 71,50 |
2500+ | € 1,26 | € 63,00 |
Documente tehnice
Specificatii
Thermal Conductivity
0.5W/m·K
Material
Hi-Flow 625
Self-Adhesive
Yes
Material
Hi-Flow 625
Temperatura minima de lucru
-30°C
Temperatura maxima de lucru
+150°C
Grosime
0.127mm
Temperatura de lucru
-30 → +150 °C
Latime
19mm
Lungime
25mm
Marca
BergquistDimensiuni
25 x 19mm
Tara de origine
United States
Detalii produs
IDC Cabling Gun
2.54mm Kontek Comatel HE14 IEC 603-8 Range
Tin plated board to board/board to wire interconnection system